I.S. EN IEC 62148-1:2018
Current
The latest, up-to-date edition.
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 1: GENERAL AND GUIDANCE
Hardcopy , PDF
English
28-03-2018
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National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Specifications of optical interfaces
6 Specifications of electrical interfaces
7 Outline and footprint of active components and devices
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Pertains to assure interchangeability in physical interfaces between fibre optic active components and devices supplied by different manufacturers, but it does not guarantee operation between such devices.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. Supersedes I.S. EN 62148-1. (03/2018)
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| DocumentType |
Standard
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| Pages |
0
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| PublisherName |
National Standards Authority of Ireland
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| Status |
Current
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| Standards | Relationship |
| IEC 62148-1:2017 | Identical |
| EN IEC 62148-1:2018 | Identical |
| IEC 60603-12:1992 | Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| EN ISO 1101:2017 | Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2017) |
| IEC 60603-6:1987 | Connectors for frequencies below 3 MHz for use with printed boards - Part 6: Edge socket connectors and printed board connectors with 2,54 mm (0,1 in) contact spacing for single or double-sided printed boards of 1,6 mm (0,063 in) nominal thickness |
| IEC 60603-11:1992 | Connectors for frequencies below 3 MHz for use with printed boards - Part 11: Detail specification for concentric connectors (dimensions for free connectors and fixed connectors) |
| IEC 60603-2:1995 | Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features |
| IEC 60603-14:1998 | Connectors for frequencies below 3 MHz for use with printed boards - Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment |
| IEC 60603-7:2008+AMD1:2011 CSV | Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors |
| IEC 60603-4:1987 | Connectors for frequencies below 3 MHz for use with printed boards - Part 4: Two-part connectors for printed boards having contacts spaced at 1,91 mm (0,075 in) centres and staggered terminations at that same spacing |
| IEC 60603-8:1990 | Connectors for frequencies below 3 MHz for use with printed boards. Part 8: Two-part connectors for printed boards, for basic grid of 2.54 mm (0.1 in), with square male contacts of 0.63 mm x 0.63 mm |
| IEC 60603-13:1995 | Connectors for frequencies below 3 MHz for use with printed boards - Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displacement terminations (ID) |
| IEC 60603-3:1987 | Connectors for frequencies below 3 MHz for use with printed boards - Part 3: Two-part connectors for printed boards having contacts spaced at 2,54 mm (0,100 in) centres and staggered terminations at that same spacing |
| IEC 60603-5:1987 | Connectors for frequencies below 3 MHz for use with printed boards - Part 5: Edge-socket connectors and two-part connectors for double-sided printed boards with 2,54 mm (0,1 in) spacing |
| EN 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
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