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I.S. EN 62739-2:2016

Current

Current

The latest, up-to-date edition.

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Preview

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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Erosion depth measurement
6 Items to be recorded in test report
Annex A (normative) - Specifications of test equipment
        and measurement equipment
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their corresponding
         European publications

Gives an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. Also aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
46
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62739-2:2016 Identical

IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
ISO 16143-3:2014 Stainless steels for general purposes — Part 3: Wire
ISO 16143-2:2014 Stainless steels for general purposes — Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
ISO 16143-1:2014 Stainless steels for general purposes — Part 1: Corrosion-resistant flat products
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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