I.S. EN 62025-2:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
Hardcopy , PDF
12-12-2019
English
01-01-2005
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test conditions
4.1 Standard atmospheric conditions for test
4.2 Referee conditions
5 Mechanical characteristics test
5.1 Body strength test
5.2 Robustness of termination (electrode)
5.3 Solderability
5.4 Resistance to soldering heat
5.5 Resistance to dissolution of metallization
5.6 Vibration
5.7 Resistance to shock
Annex A (normative) Mounting of surface mounting inductor
to test printed-circuit board
Provides a test method for the non-electrical characteristics of the Surface Mounted Device (SMD) inductors to be used for electronic and telecommunication equipment. Defines methods for measuring mechanical performance only.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NF EN 62025-2 : 2005 | Identical |
| IEC 62025-2:2005 | Identical |
| DIN EN 62025-2:2005-08 | Identical |
| EN 62025-2:2005 | Identical |
| BS EN 62025-2:2005 | Identical |
| NBN EN 62025-2 : 2006 | Identical |
| EN 62211:2017 | Inductive components - Reliability management |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 62211:2017 | Inductive components - Reliability management |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| EN 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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