I.S. EN 61190-1-2:2014
Current
The latest, up-to-date edition.
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
Hardcopy , PDF
English
01-01-2014
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Standardized description for products
5 Test methods
6 Requirements
7 Quality assurance provisions
8 Preparation for delivery
9 Additional information - Performance and shelf life
extension inspections
Annex A (normative) - Test report on solder paste
Annex B (informative) - Reflow condition and profile
Annex C (informative) - Typical comparison of particle
size distributions between laser diffraction
method and screen method
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
58
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 61190-1-2:2014-11 | Identical |
| EN 61190-1-2:2014 | Identical |
| NF EN 61190-1-2 : 2014 | Identical |
| IEC 61190-1-2:2014 | Identical |
| BS EN 61190-1-2:2014 | Identical |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| IPC HDBK 005 : 0 | GUIDE TO SOLDER PASTE ASSESSMENT |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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