I.S. EN 61188-5-8:2008
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
Hardcopy , PDF
English
01-01-2008
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 BGA (square)
4.1 Field of application
4.2 Component descriptions
4.2.1 Basic construction
4.2.2 Termination materials
4.2.3 Marking
4.2.4 Carrier package format
4.2.5 Process considerations
4.3 Component dimensions (square)
4.3.1 PBGA 1,5 mm pitch component
dimensions (square)
4.3.2 PBGA 1,27 mm pitch component
dimensions (square)
4.3.3 PBGA 1,00 mm pitch component
dimensions (square)
4.4 Solder joint fillet design
4.4.1 Solder joint fillet design - Non-collapsing,
collapsing (level 3)
4.5 Land pattern dimensions
4.5.1 PBGA 1,5 mm pitch land pattern
dimensions (square)
4.5.2 PBGA 1,27 mm pitch land pattern
dimensions (square)
4.5.3 PBGA 1,00 mm pitch land pattern
dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
6.1 Field of application
6.2 Component descriptions
6.2.1 Basic construction
6.2.2 Termination materials
6.2.3 Marking
6.2.4 Carrier package format
6.2.5 Process considerations
6.3 Component dimensions (rectangular)
6.4 Solder joint fillet design
6.4.1 Solder joint fillet design - Collapsing
(level 3)
6.4.2 Land approximation
6.4.3 Total variation
6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
Describes information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61188-5-8:2007 | Identical |
| EN 61188-5-8:2008 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
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