I.S. EN 16602-70-08:2015
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS
Hardcopy , PDF
15-06-2023
English
01-01-2015
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Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of reliable soldered connections
5 Preparatory conditions
6 Materials selection
7 Preparation for soldering
8 Mounting of components
9 Attachment of conductors to terminals, solder
cups and cables
10 Soldering to terminals and PCBs
11 Cleaning of PCB assemblies
12 Final inspection
13 Verification procedure
14 Quality assurance
15 Workmanship standards
Annex A (normative) - Report on manual soldering
of high-reliability electrical connections - DRD
Annex B (informative) - Solder melting temperatures
and choice
Bibliography
Provides the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, highreliability electrical connections.
| DocumentType |
Standard
|
| Pages |
106
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| EN 16602-70-08:2015 | Identical |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| EN 16602-70-10:2015 | Space product assurance - Qualification of printed circuit boards |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| EN 16602-70-71:2016 | Space product assurance - Materials, processes and their data selection |
| EN 16601-00-01:2015 | Space systems - Glossary of terms |
| EN 16602-10-09:2014 | Space product assurance - Nonconformance control system |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
| EN 61340-5-2:2001/corrigendum:2001 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
| EN 16603-10-03:2014 | Space engineering - Testing |
| EN 16602-70-28:2014 | Space product assurance - Repair and modification of printed circuit board assemblies for space use |
| EN 16602-70-02:2014 | Space product assurance - Thermal vacuum outgassing test for the screening of space materials |
| EN 16602-20:2014 | Space product assurance - Quality assurance |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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