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EN ISO 9453:2014

EN ISO 9453:2014

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)

Superseded date

21-10-2020

Superseded by

EN ISO 9453:2020

Published date

06-08-2014

Publisher

Comite Europeen de Normalisation

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Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
        in ISO 9453 and short names and chemical
        compositions according to IEC 61190-1-3
Annex B (informative) - Patented alloys and patent holder list
Bibliography

ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

Committee
CEN/TC 121
DevelopmentNote
Supersedes EN 29453. (11/2006) Supersedes PREN ISO 9453. (09/2014)
DocumentType
Standard
PublisherName
Comite Europeen de Normalisation
Status
Superseded
SupersededBy
Supersedes

I.S. EN 13148:2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
EN 61189-11 : 2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
EN 60851-4:2016 Winding wires - Test methods - Part 4: Chemical properties
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
BS EN 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
I.S. EN 61190-1-3:2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
BS EN 13148:2010 Copper and copper alloys. Hot-dip tinned strip
DIN EN 13148:2010-12 Copper and copper alloys - Hot-dip tinned strip
UNI EN 806-4 : 2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
BS EN 806-4:2010 Specifications for installations inside buildings conveying water for human consumption Installation
I.S. EN 61189-11:2013 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV))
EN IEC 62024-1:2018 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
BS EN 61190-1-3 : 2007 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
NF EN 806-4 : 2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
UNI EN 13148 : 2010 COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP
BS EN 60851-4:1998 Winding Wires. Test methods Chemical properties
DIN EN 806-4:2010-06 Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation
I.S. EN 60851-4:2016 WINDING WIRES - TEST METHODS - PART 4: CHEMICAL PROPERTIES
I.S. EN 806-4:2010 SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION
UNE-EN 13148:2012 Copper and copper alloys - Hot-dip tinned strip
EN 806-4:2010 Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation
BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
10/30227098 DC : 0 BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE
I.S. EN IEC 62024-1:2018 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
EN 13148:2010 Copper and copper alloys - Hot-dip tinned strip
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

ISO 3677:2016 Filler metal for soldering and brazing — Designation
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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