
EN 62047-6:2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
08-02-2022
05-03-2010
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test piece
5 Testing method and test apparatus
6 Endurances (test termination)
7 Test report
Annex A (informative) Technical background of
this standard
Annex B (informative) Test piece
Annex C (informative) Displacement measurement
Annex D (informative) Testing environment
Annex E (informative) Number of test pieces
Bibliography
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.
Committee |
CLC/TC 47X
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
I.S. EN 62047-6:2010 | Identical |
IEC 62047-6:2009 | Identical |
NEN EN IEC 62047-6 : 2010 | Identical |
UNE-EN 62047-6:2010 | Identical |
DIN EN 62047-6:2010-07 | Identical |
PN EN 62047-6 : 2010 | Identical |
NF EN 62047-6 : 2010 | Identical |
CEI EN 62047-6 : 2011 | Identical |
BS EN 62047-6:2010 | Identical |
BS EN IEC 61970-457:2021 | Identical |
PNE-prEN 62047-6 | Identical |
BS EN 62047-18:2013 | Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials |
CEI EN 62047-18 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS |
I.S. EN 62047-18:2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS (IEC 62047-18:2013 (EQV)) |
ASTM E 466 : 2015 : REDLINE | Standard Practice for Conducting Force Controlled Constant Amplitude Axial Fatigue Tests of Metallic Materials |
ISO 6892:1998 | Metallic materials Tensile testing at ambient temperature |
IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
ASTM E 1823 : 2013-07 | TERMINOLOGY RELATING TO FATIGUE AND FRACTURE TESTING |
ISO 1099:2017 | Metallic materials — Fatigue testing — Axial force-controlled method |
ISO 12107:2012 | Metallic materials — Fatigue testing — Statistical planning and analysis of data |
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