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EN 62047-17:2015

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

Published date

10-07-2015

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Principle of bulge test
5 Test apparatus and environment
6 Specimen
7 Test procedure and analysis
8 Test report
Annex A (informative) - Determination of mechanical
        properties
Annex B (informative) - Deformation measurement
        techniques
Annex C (informative) - Example of test piece fabrication:
        MEMS process
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm.The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

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