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EN 62025-2:2005

EN 62025-2:2005

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

Superseded date

02-12-2019

Superseded by

EN IEC 62025-2:2019

Published date

28-02-2005

Publisher

European Committee for Standards - Electrical

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1 Scope
2 Normative references
3 Terms and definitions
4 Test conditions
  4.1 Standard atmospheric conditions for test
  4.2 Referee conditions
5 Mechanical characteristics test
  5.1 Body strength test
  5.2 Robustness of termination (electrode)
  5.3 Solderability
  5.4 Resistance to soldering heat
  5.5 Resistance to dissolution of metallization
  5.6 Vibration
  5.7 Resistance to shock
Annex A (normative) Mounting of surface mounting inductor
                     to test printed-circuit board
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications
Figures
Tables

Specifies a test method for the non-electrical characteristics of the surface mounted device inductors to be used for electronic and telecommunication equipment. Defines methods for measuring mechanical performance only. To be used in conjunction with EN 62211.

Committee
CLC/SR 51
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Superseded
SupersededBy

EN 62674-1 : 2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012)
BS EN 62674-1:2012 High frequency inductive components Fixed surface mount inductors for use in electronic and telecommunication equipment
I.S. EN 62674-1:2012 HIGH FREQUENCY INDUCTIVE COMPONENTS - PART 1: FIXED SURFACE MOUNT INDUCTORS FOR USE IN ELECTRONIC AND TELECOMMUNICATION EQUIPMENT (IEC 62674-1:2012 (EQV))

EN 62211:2017 Inductive components - Reliability management
IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 62211:2017 Inductive components - Reliability management
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
EN 60068-2-27:2009 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
IEC 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
EN 60068-2-77:1999 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
EN 60068-5-2:1999 Environmental testing - Part 5: Guide to drafting of test methods - Terms and definitions

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