EN 61340-5-2:2001/corrigendum:2001
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
24-04-2008
03-08-2001
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Signs and markings - General
4.1 Markings
4.1.1 ESDS marking
4.1.2 Packaging marking
4.1.3 Equipment marking
4.3 Signs for ESD protected areas (EPA)
5 ESD protected area (EPA) - General
5.1 Configuration
5.1.1 General
5.1.3 High-voltage EPA
5.2 Requirements for specific ESD protective items
5.2.1 General
5.2.2 Working surfaces and storage racks
5.2.3 Floors
5.2.4 Seating
5.2.5 Garments
5.2.6 Gloves and finger cots
5.2.7 Wrist strap
5.2.8 Footwear
5.2.9 Ionisers
5.2.10 Tools, machinery, dispensers and test equipment
5.2.11 Trolleys and carts
5.3 Construction of an EPA
5.3.1 General
5.3.2 EPA ground facility
5.3.3 EPA ground bonding point (EBP)
5.3.4 EPA ground cords
5.3.5 Electrostatic fields
5.3.6 Certification of conformance
5.4 Field work
5.5 EPA working practices
6 Protective packaging
7 Purchase, receipt, storage and handling
7.1 General
7.2 Purchase
7.3 Receipt and storage
7.4 Unpacking, inspection and storage within an EPA
8 Training
8.1 Relevant structured training ESD
8.2 Personnel training
8.4 Items for consideration in training
8.5 Retraining
8.6 Register of trained personnel
8.7 Training provided by the ESD co-ordinator
8.8 Training officer qualification
9 Quality responsibilities
9.1 Responsibilities
9.2 ESD co-ordinator
9.3 Procurement of ESD protective items
9.4 Checking of electrostatic precautions
9.6 Daily checks
9.6.1 Visual daily check
9.6.2 Wrist straps
9.6.3 Non-permanent footwear
9.7 Monthly checks
9.8 Six-monthly checks
9.8.1 General
9.8.2 Electrostatic fields
9.8.3 Signs and labels
10 Periodic audit instructions
10.1 Table 1 of IEC 61340-5-1 - ESD protective item
requirements
10.2 Table 2 of IEC 61340-5-1 - Packaging
characteristics
10.3 Table 3 of IEC 61340-5-1 - Example of audit
report (summary)
10.4 Table 4 of IEC 61340-5-1 - EPA equipment list
Annex A (normative) Test methods
A.1 - Resistance measurement method for the testing of
floor, working surface or storage rack
A.2 - Resistance measurement method for the testing of
seating
A.3 - Resistance measurement method for the testing of
garments
A.5 - Wrist straps, footwear, gloves, finger cots and
tools
A.6 - Test method and equipment for ionisation
A.7 - Test method for evaluating the performance of
electrostatic discharge shielding material -
Bags
Annex B (informative) Test methods for charge decay
B.1 - Method of measurement of charge decay
Annex C (informative) Design considerations to minimise the
effects of ESD
C.1 - Identification
C.3 - Design of electrostatic discharge sensitive
devices (ESDS)
C.4 - Design of assemblies
C.5 - Packaging design
C.6 - System design
C.7 - Design evaluation procedure
Annex DD (informative) Principles and methods of controlling
static electricity
DD.1 - Methods
DD.2 - Principles
Annex EE (informative) Principles of relationship between
charge, charge density, field and
potential
EE.1 - Insulated conducting body
EE.2 - Insulating body
Annex FF (informative) Bibliography
Figure 101 - Maximum body voltage generated against resistance
Covers protection from electrostatic discharge (ESD) damage of all electronic devices (components, assemblies and sub-assemblies) with voltage sensitivity not lower than 100 V through their entire life from the beginning of manufacture, through product assembly, product use and possibly repair until the end of the product life.
Committee |
SR 101
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DevelopmentNote |
To be read in conjunction with EN 61340-5-1 (11/2001) Supersedes EN 100015-1, 2, 3 and 4. (03/2004)
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DocumentType |
Standard
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PublisherName |
European Committee for Standards - Electrical
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Status |
Superseded
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SupersededBy | |
Supersedes |
Standards | Relationship |
NF EN 61340-5-2 : 2001 | Identical |
NBN EN 61340 5-2 : 2001 | Identical |
NEN EN IEC 61340-5-2 : 2001 C11 2001 | Identical |
I.S. EN 61340-5-2:1999 | Identical |
PN EN 61340-5-2 : 2002 | Identical |
SN EN 61340-5-2 : 2001 | Identical |
VDE 0300-5-2 : 2002 | Identical |
BS EN 61340-5-2:2001 | Identical |
UNE-EN 61340-5-2:2002 | Identical |
CEI EN 61340-5-2 : 1ED 2001 | Identical |
DIN EN 61340-5-2 : 2002 | Identical |
IEC TS 61340-5-2:1999 | Identical |
BS EN 16602-70-08:2015 | Space product assurance. Manual soldering of high-reliability electrical connections |
BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
PD CLC/TR 62258-3:2007 | Semiconductor die products Recommendations for good practice in handling, packing and storage |
BS EN 60747-16-1 : 2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
ISO 4586-3:2015 | High-pressure decorative laminates (HPL, HPDL) Sheets based on thermosetting resins (Usually called Laminates) Part 3: Classification and specifications for laminates less than 2 mm thick and intended for bonding to supporting substrates |
I.S. EN 60747-16-1:2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
VDI 2083 Blatt 17:2013-06 | Cleanroom technology - Compatibility of materials with the required cleanliness |
VDI 2083 Blatt 9.1:2006-12 | Clean room technology - Compatibility with required cleanliness and surface cleanliness |
08/30190157 DC : DRAFT SEP 2008 | BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS |
EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
17/30355242 DC : 0 | BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
CEI EN 60747-16-1 : 2009 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
I.S. EN 16602-70-08:2015 | SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS |
EN 16602-70-08:2015 | Space product assurance - Manual soldering of high-reliability electrical connections |
I.S. CLC/TR 62258-3:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
CEI CLC/TR 62258-3 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
EN 60747-16-1:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
IEC TS 60479-1:2005+AMD1:2016 CSV | Effects of current on human beings and livestock - Part 1: Generalaspects |
ISO 7873:1993 | Control charts for arithmetic average with warning limits |
ISO 7870:1993 | Control charts General guide and introduction |
EN 100015-3 : 1993 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: REQUIREMENTS FOR CLEAN ROOM AREAS |
EN 100015-1 : 1992 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. BASIC SPECIFICATION: PROTECTION OF ELECTROSTATIC SENSITIVE DEVICES - GENERAL REQUIREMENTS |
IEC 61340-4-1:2003+AMD1:2015 CSV | Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors |
EN 100015-2 : 1993 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: PROTECTION OF ELECTROSTATIC SENSITIVE DEVICES |
ISO 7966:1993 | Acceptance control charts |
EN 100015-4 : 1993 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: REQUIREMENTS FOR HIGH VOLTAGE ENVIRONMENTS |
ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
IEC 61010-1:2010+AMD1:2016 CSV | Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements |
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