EN 61189-11 : 2013
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS
28-06-2013
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting temperatures
of solder alloys
Annex B (informative) - Examples of test result (Method A)
Annex C (informative) - Example of test result (Method B)
Annex ZA (normative) - Normative references to international
Publications with their corresponding
European publications
Bibliography
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
| Committee |
SR 91
|
| DocumentType |
Test Method
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61189-11:2013 | Identical |
| NBN EN 61189-11 : 2013 | Identical |
| NEN EN IEC 61189-11 : 2013 | Identical |
| I.S. EN 61189-11:2013 | Identical |
| PN EN 61189-11 : 2013 | Identical |
| UNE-EN 61189-11:2013 | Identical |
| SN EN 61189-11:2013 | Identical |
| BS EN 61189-11:2013 | Identical |
| CEI EN 61189-11 : 2014 | Identical |
| DIN EN 61189-11:2014-02 | Identical |
| PNE-FprEN 61189-11 | Identical |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| EN ISO 11357-1:2016 | Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2016) |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN ISO 9453:2014 | Soft solder alloys - Chemical compositions and forms (ISO 9453:2014) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| ISO 11357-1:2016 | Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.