EN 60286-4:2013
Current
The latest, up-to-date edition.
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
08-11-2013
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and conventions
4 Shape and cross-section of stick magazine
5 Dimensions of stick magazines
6 Mechanical stability
7 End stoppers and spacers
8 Orientation of the components in the stick magazine
9 Marking
Annex A (informative) - DIL packages for through-hole mount
Annex B (informative) - SO packages for surface mounting
Annex C (informative) - Leaded chip carrier packages
(PLCC) for surface mounting
Annex D (normative) - Rule for the orientation of integrated
circuit packages in handling and shipping
carriers such as stick magazines and rails
(from IEC 60191-3:1999, Annex G)
Bibliography
Annex ZA (normative) - Normative references to international
Publications with their corresponding
European publications
IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.
Committee |
CLC/SR 40
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
DIN EN 60286-4:2014-04 | Identical |
I.S. EN 60286-4:2013 | Identical |
NBN EN 60286-4 : 2014 | Identical |
CEI EN 60286-4 : 2014 | Identical |
IEC 60286-4:2013 | Identical |
SN EN 60286-4 : 1997 | Identical |
NEN EN IEC 60286-4 : 2013 | Identical |
BS EN 60286-4:2013 | Identical |
NF EN 60286-4 : 2014 | Identical |
PN EN 60286-4 : 2013 | Identical |
UNE-EN 60286-4:2000 | Identical |
UNE-EN 60286-4:2013 | Identical |
PNE-FprEN 60286-4 | Identical |
I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
CEI EN 61760-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61188-5-4:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
EN 61188-5-4 : 2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
ISO 11469:2016 | Plastics — Generic identification and marking of plastics products |
IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
EN 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
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