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EN 16602-70-08:2015

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Space product assurance - Manual soldering of high-reliability electrical connections

Withdrawn date

31-07-2015

Published date

28-01-2015

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Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of reliable soldered connections
5 Preparatory conditions
6 Materials selection
7 Preparation for soldering
8 Mounting of components
9 Attachment of conductors to terminals, solder
   cups and cables
10 Soldering to terminals and PCBs
11 Cleaning of PCB assemblies
12 Final inspection
13 Verification procedure
14 Quality assurance
15 Workmanship standards
Annex A (normative) - Report on manual soldering
        of high-reliability electrical connections - DRD
Annex B (informative) - Solder melting temperatures
        and choice
Bibliography

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.

Committee
CEN/CLC/JTC 5
DocumentType
Standard
ProductNote
This standard is identical to ECSS-Q-ST-70-08C
PublisherName
Comite Europeen de Normalisation
Status
Withdrawn

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EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
EN 16602-70-28:2014 Space product assurance - Repair and modification of printed circuit board assemblies for space use
EN 16602-70-71:2016 Space product assurance - Materials, processes and their data selection
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I.S. EN 16602-70-30:2014 SPACE PRODUCT ASSURANCE - WIRE WRAPPING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS
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EN 16603-10-03:2014 Space engineering - Testing
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EN 16602-70-02:2014 Space product assurance - Thermal vacuum outgassing test for the screening of space materials
EN 16602-20:2014 Space product assurance - Quality assurance
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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