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EN 123300 : 1992 AMD 1 1995

Current

Current

The latest, up-to-date edition.

SECTIONAL SPECIFICATION: MULTILAYER PRINTED BOARDS

Published date

09-08-1995

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FOREWORD
PREFACE
1 Introduction
  1.1 Scope and object
  1.2 Related documents
2 General
3 Test specimens
  3.1 Capability approval
  3.2 Quality conformance inspection
4 Relevant specification
5 Characteristics of printed boards
6 Capability test programme
7 Quality conformance inspection
8 Test patterns
  8.1 Application of test patterns and test boards
  8.2 Composite test pattern (CTP)
  8.3 Structure of test boards
  8.4 Multiple arrangements of the CTP

Applies to multilayer printed boards regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).

Committee
SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

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BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

CECC 23000 : 1985 GENERIC SPECIFICATION: PRINTED BOARDS
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IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
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