DSCC 10012 : 0
Current
Current
The latest, up-to-date edition.
PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
Published date
29-02-2012
Publisher
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the requirements for a family of rigid multilayered printed wiring boards that contain plated through holes.
| Committee |
FSC 5998
|
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Current
|
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 4552 : 0 | PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
| SAE AMS 2422 : 2014 | PLATING, GOLD |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| MIL-PRF-81705 Revision E:2009 | Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| MIL-STD-130 Revision N:2007 | IDENTIFICATION MARKING OF U.S. MILITARY PROPERTY |
| MIL-D-3464 Revision E:1987 | DESICCANTS, ACTIVATED, BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION |
| IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| MIL-DTL-45204 Revision D:2007 | Gold Plating, Electrodeposited |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| SAE AMS QQ N 290 : 2015 | NICKEL PLATING (ELECTRODEPOSITED) |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| ASTM B 545 : 2013 : REDLINE | Standard Specification for Electrodeposited Coatings of Tin |
| IPC 4563 : 0 | RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE |
| SAE AMS 2418 : 2017 | PLATING, COPPER |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC SM 840 : E | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| MIL-PRF-22191 Revision F:2008 | Barrier Materials, Transparent, Flexible, Heat-Sealable |
| SAE AMS 2403 : 2015 | PLATING, NICKEL, GENERAL PURPOSE |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| SAE AMS P 81728 : 2015 | PLATING, TIN-LEAD (ELECTRODEPOSITED) |
| IPC 4781 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT, SEMI-PERMANENT AND TEMPORARY LEGEND AND/OR MARKING INK |
| IPC D 350 : 0 | PRINTED BOARD DESCRIPTION IN DIGITAL FORM |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
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