DOD-STD-2000-2 Revision A:1986

1 SCOPE
  1.1 Applicability
2 REFERENCED DOCUMENTS
  2.1 Government documents
       2.1.1 Specifications, standards and handbooks
  2.2 Other publications
3 DEFINITIONS
  3.1 Terms and definitions
4 GENERAL REQUIREMENTS
  4.1 Conflict
  4.2 Design
       4.2.1 Design requirements information
  4.3 Solder processes and processing
  4.4 Soldered connections
  4.5 Hybrid microelectronic modules and assemblies
  4.6 Electrostatic discharge
  4.7 Component positioning
  4.8 Visibility of markings
  4.9 Part marking and reference designations
  4.10 Interference spacing
  4.11 Part clearance spacing
  4.12 Piggybacking
  4.13 Lead forming
       4.13.1 Lead malforming limits
       4.13.2 Tempered leads
  4.14 Jumper wires
  4.15 Insulation clearance
  4.16 Eyelets
  4.17 Resins and other adhesives
5 DETAIL REQUIREMENTS
  5.1 Mounting of parts and components
       5.1.1 Parts and components mounted to printed wiring
              boards
       5.1.2 Terminal board mountings
       5.1.3 Mounting to terminals
6 NOTES
  6.1 Supersession note
  6.2 Changes from previous issue
  6.3 Subject term (key word listing)
  6.4 Use of metric units
INDEX
INDEX OF REFERENCED DOCUMENTS

Specifies mounting for electrical and electronic components and wiring in aircraft, guided missiles, satellites, ammunition and weapon systems, shipboard weapon systems, ground vehicle equipment, and program critical ground support equipment.

This standard prescribes mounting criteria for electrical and electronic components and wiring used in guided missiles, aircraft, satellites, shipboard weapon systems, ammunition and weapon systems, ground vehicle equipment, and program critical ground support equipment. Soldering processes and procedures, and criteria for obtaining high quality/high reliability electrical and electronic solder connections are covered in DOD-STD-2000-1, and DOD-STD-2000-3, respectively.