DOD-STD-2000-1 Revision B:1986
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Soldering Technology, High Quality/High Reliability (S/S by MIL-STD-2000)
English
10-06-1986
23-07-2013
Specifies soldering processes for critical electronic connections on guided missiles, aircraft, ammunition and weapon systems, avionics systems, communication equipment, satellites, shipboard weapons systems, ground vehicle equipment, and program critical ground support equipment. DOD-STD-2000/1/2/3/4 HAVE BEEN COMBINED AND SUPERSEDED BY MIL-STD- 2000
| DocumentType |
Standard
|
| Pages |
146
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
This standard is applicable to soldering processes for high quality/high reliability electrical and electronic connections on guided missiles, aircraft, avionics systems, communication equipment, satellites, shipboard weapons systems, ammunition and weapon systems, ground vehicle equipment, and program critical ground support equipment.
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| MIL-M-38510 Revision J:1991 | Microcircuits, General Specification for |
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| DOD HDBK 263 : LATEST | ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)METRIC |
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| MIL I 23053 : D | INSULATION SLEEVING, ELECTRICAL, HEAT SHRINKABLE MODIFIED FLUOROPOLYMER, CROSSLINKED |
| MIL-STD-1389 Revision D:1989 | DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES |
| MIL-I-7444 Revision D:1984 | Insulation Sleeving, Electrical, Flexible (See Notice 3 for Replacement Information) |
| TT B 848 : B | BUTYL ALCOHOL, SECONDARY (FOR USE IN ORGANIC COATINGS) |
| FED-STD-376 Revision B:1993 | Preferred Metric Units for General Use by the Federal Government |
| MIL-S-83519 Revision A:1984 | SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT GENERAL SPECIFICATION FOR (S/S BY SAE-AS83519) |
| MIL-F-14256 Revision F:1993 | Flux, Soldering, Liquid, Paste Flux, Solder Paste and Solder-Paste Flux, (for Electronic/Electrical use), General Specification for (S/S by J-STD-004, J-STD-005 and J-STD-006) |
| TT-I-735 Revision A:1963 | Isopropyl Alcohol |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL P 55110 : LATEST | PRINTED WIRING BOARD, RIGID GENERAL SPECIFICATION FOR |
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| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
| O-E-760 Revision D:1987 | ETHYL ALCOHOL (ETHANOL); DENATURED ALCOHOL; PROPRIETARY SOLVENTS AND SPECIAL INDUSTRIAL SOLVENTS (S/S BY A-A-59282, A-A-51693, A-A-53880) |
| O-M-232 Revision M:2016 | Methanol (Methyl Alcohol) |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
| MIL-T-81533 Revision A:1967 | Trichloroethane 1, 1, 1, (Methyl Chloroform) Inhibited, Vapor Degreasing (No S/S Document) |
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