DIN EN 61967-4:2006-07

1 Scope
2 Normative references
3 Definitions
4 General
  4.1 Measurement basics
  4.2 RF current measurement
  4.3 RF voltage measurement at IC pins
  4.4 Assessment of the measurement technique
5 Test conditions
6 Test equipment
  6.1 Test receiver specification
  6.2 RF current probe specification
  6.3 Test of the RF current probe capability
  6.4 Matching network specification
7 Test set-up
  7.1 General test configuration
  7.2 Printed circuit test board layout
8 Test procedure
9 Test report
Annex A (normative) Probe calibration procedure
Annex B (informative) Classification of conducted emission
        levels
  B.1 Introductory remark
  B.2 General
  B.3 Definition of emission levels
  B.4 Presentation of results
Annex C (informative) Example of reference levels for
        automotive applications
  C.1 Introductory remark
  C.2 General
  C.3 Reference level
Annex D (informative) EMC requirements and how to use
        EMC IC measurement techniques
  D.1 Introduction
  D.2 Using EMC measurement procedures
  D.3 Assessment of the IC influence to the EMC behaviour
      of the modules
Annex E (informative) Example of a test set-up consisting
        of an EMC main test board and an EMC IC test board
  E.1 The EMC main test board
  E.2 EMC IC test board
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Figures
Tables

Specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 ohm resistive probe and RF voltage measurement using a 150 ohm coupling network.