CEI EN 60068-2-69 : 2008
Current
The latest, up-to-date edition.
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
Hardcopy , PDF
English - Italian
01-01-2008
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the method
5 Description of the test apparatus
6 Preparation of specimens
7 Materials
8 Procedure
9 Presentation of results
10 Information to be given in the relevant specification
Annex A (normative) - Equipment specification
Annex B (informative) - Use of the wetting balance
for SMD solderability testing
Annex C (normative) - Test methods for SMD components
sizes 0603M (0201) or Smaller
Annex D (informative) - Evaluation criteria - Guidance
Annex E (informative) - Method of calculating the maximum
theoretical force and integrated value of the area of
the wetting curve for leaded non-SMD
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-49. (04/2008) 2ED 2008 Edition is valid until 11-04-2020; and only available in combined English/Italian. Supersedes CEI EN 60068-2-54 which remains current and will be withdrawn on 11-04-2020. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-69:2017 | Identical |
| EN 60068-2-69:2017/AC:2018-03 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| EN 60068-2-66:1994 | Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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