CEI CECC 200025 : 2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
Hardcopy , PDF
01-07-2020
English
01-01-2000
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Introduction
1 General requirements
2 Quality requirements of the process sequence
3 Specialist Assembly Facility documentation requirements
4 Audits
5 Corrective actions and failure analysis
6 Interface between Assembly Facility and Customer
7 Training
8 Notification of modifications to capability
Annexes
Annex A - Definitions
Annex B - Form and content of process specifications
Annex C - Form and content of Process Manuals
Annex D - Format of first page of Process Approval report
Annex E - Example abstract of description of Process Approval
Annex F - Audit check list (technical)
Annex G - Abbreviations
Defines the terms, definitions, symbols, quality system, assessment and verification methods, and other requirements relevant to the operation of a printed board Assembly Facility in compliance with the general requirements of the CECC System for electronic components of assessed quality.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-1 (01/2003)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CECC 200025 : 1998 | Identical |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN ISO 9002:1994/AC:1997 | QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
| CECC 00114-5 : 94 AMD 2 | PROCESS APPROVAL OF SPECIALIST CONTRACTORS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY |
| EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| CECC 00200 : 2002 | REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| CECC 200 012 : 1995 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD DESIGNED FACILITIES |
| CECC 00401 : 91 AMD 1 | GLOSSARY OF ABBREVIATIONS, TERMS AND DEFINITIONS OF THE CECC SYSTEM |
| EN ISO 9000:2015 | Quality management systems - Fundamentals and vocabulary (ISO 9000:2015) |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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