CEI 56-44 : 2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
DEPENDABILITY MANAGEMENT - PART 3-7: APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE
Hardcopy , PDF
01-06-2021
English
01-01-2000
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Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
screening programme
6 General information about the reliability stress
screening process
7 Analysis of the benefits of the reliability stress
screening process
8 Characteristics of a successful reliability stress
screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress concerning
process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
stress screening process
Annex A (informative) - RSS of repairable items produced
in lots
Annex B (informative) - RSS of electronic components
Gives a guide to reliability stress screening process for electronic hardware.
| Committee |
CT 56
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60300-3-7:1999 | Identical |
| CEI 56-46 : 2005 | DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| IEC 61163-1:2006 | Reliability stress screening - Part 1: Repairable assemblies manufactured in lots |
| IEC 61163-2:1998 | Reliability stress screening - Part 2: Electronic components |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
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