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BS IEC 60300-3.7 : 1999

Current

Current

The latest, up-to-date edition.

DEPENDABILITY MANAGEMENT - APPLICATION GUIDE - RELIABILITY STRESS SCREENING OF ELECTRONIC HARDWARE

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-1999

£218.00
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
    screening programme
6 General information about the reliability stress
    screening process
7 Analysis of the benefits of the reliability stress
    screening process
8 Characteristics of a successful reliability stress
    screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress screening
    process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
    stress screening process
    15.1 General
    15.2 Step 1 - Identification of objectives and goals
    15.3 Step 2 - Screening process design and application
    15.4 Step 3 - Cost-benefit analysis
    15.5 Step 4 - Preparation of a screening plan
    15.6 Step 5 - Screening process data collection,
           analysis and corrective actions
Figures
1 Levels where reliability stress screening can be
    performed
2 Reliability stress screening of repairable items
3 Flow chart for control of a reliability stress
    screening process
A.1 Level chosen for the RSS process
Table
A.1 Relation between the sensitivity of flaws and stresses
Annex A (informative) RSS of repairable items produced
in lots
Annex B (informative) RSS of electronic components

Acts as an application guide to a reliability stress screening process for electronic hardware. Explains the concept, purpose and justification of the screening process, and states the main elements of a screening programme, as well as the general planning method.

Committee
DS/1/1
DevelopmentNote
Supersedes 96/402942 DC. (06/2005)
DocumentType
Standard
Pages
38
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
IEC 60300-3-7:1999 Identical

03/101534 DC : DRAFT JAN 2003 BS 5760-4 - RELIABILITY OF SYSTEMS, EQUIPMENT AND COMPONENTS - PART 4: GUIDE TO THE SPECIFICATION OF DEPENDABILITY REQUIREMENTS
BS 5760-4:2003 Reliability of systems, equipment and components Guide to the specification of dependability requirements

MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
MIL-STD-750 Revision F:2011 TEST METHODS FOR SEMICONDUCTOR DEVICES
IEC 61163-1:2006 Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
IEC 61163-2:1998 Reliability stress screening - Part 2: Electronic components
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods

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