BS EN 62739-3:2017
Current
The latest, up-to-date edition.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
Hardcopy , PDF
English
30-04-2017
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Selection of the appropriate erosion test method
6 Common items for each test method
7 Overview of the test methods
Annex A (informative) - Selection of test temperature,
test duration and bending stress
Annex B (informative) - Maximum depth and other
measurements
Annex C (informative) - Erosion mechanism
Annex D (informative) - Thermal acceleration for
erosion
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Explains the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 16/30338642 DC. (04/2017)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Standards | Relationship |
| IEC 62739-3:2017 | Identical |
| EN 62739-3:2017 | Identical |
| IEC 61869-3:2011 | Identical |
| EN 61869-3 : 2011 | Identical |
| IEC 62739-1:2013 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-3:2014 | Stainless steels for general purposes — Part 3: Wire |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-2:2014 | Stainless steels for general purposes — Part 2: Corrosion-resistant semi-finished products, bars, rods and sections |
| ISO 16143-1:2014 | Stainless steels for general purposes — Part 1: Corrosion-resistant flat products |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 62739-1 : 2013 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013) |
| EN 62739-2:2016 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 62739-2:2016 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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