BS EN 61190-1-2:2014
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Hardcopy , PDF
English
30-06-2014
Important note : All end users must be registered with an Account prior to user licenses being assigned.| Committee |
EPL/501
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| DevelopmentNote |
Supersedes 98/231474 DC. (08/2002) Supersedes 05/30133283 DC. (08/2007) Supersedes 12/30258438 DC. (06/2014)
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| DocumentType |
Standard
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| Pages |
26
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| PublisherName |
British Standards Institution
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| Status |
Current
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| Supersedes |
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material\'s performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of \'Reflow condition and profile\' in Annex B;
c) addition of a new Annex C.
| Standards | Relationship |
| DIN EN 61190-1-2:2014-11 | Identical |
| EN 61190-1-2:2014 | Identical |
| NF EN 61190-1-2 : 2014 | Identical |
| IEC 61190-1-2:2014 | Identical |
| I.S. EN 61190-1-2:2014 | Identical |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| IPC HDBK 005 : 0 | GUIDE TO SOLDER PASTE ASSESSMENT |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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