BS EN 60068-2-83:2011
Current
The latest, up-to-date edition.
Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Hardcopy , PDF
English
30-11-2011
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Preconditioning
6 Preparation
7 Quick heating method
8 Synchronous method
9 Temperature profile method
Annex A (normative) - Equipment for the quick
heating and synchronous method
Annex B (informative) - Reading of the output
data and correction of the result in the
quick heating test
Annex C (normative) - Test equipment for the
temperature profile method
Annex D (informative) - Reading of the output
data and correction of the result in the
temperature profile test
Annex E (informative) - Caveats/Notes
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Bibliography
Gives methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 07/30165180 DC. (11/2011)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
| Standards | Relationship |
| IEC 60068-2-83:2011 | Identical |
| EN 60068-2-83 : 2011 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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