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BS EN 16602-70-08:2015

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Space product assurance. Manual soldering of high-reliability electrical connections

Available format(s)

Hardcopy , PDF

Superseded date

19-12-2022

Superseded by

BS EN 16602-70-61:2022

Language(s)

English

Published date

31-01-2015

£298.00
Excluding VAT

Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of reliable soldered connections
5 Preparatory conditions
6 Materials selection
7 Preparation for soldering
8 Mounting of components
9 Attachment of conductors to terminals, solder
   cups and cables
10 Soldering to terminals and PCBs
11 Cleaning of PCB assemblies
12 Final inspection
13 Verification procedure
14 Quality assurance
15 Workmanship standards
Annex A (normative) - Report on manual soldering
        of high-reliability electrical connections - DRD
Annex B (informative) - Solder melting temperatures
        and choice
Bibliography

Provides the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, highreliability electrical connections.

Committee
ACE/68
DocumentType
Standard
Pages
108
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.

Standards Relationship
EN 16602-70-08:2015 Identical

MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
EN 16602-70-71:2016 Space product assurance - Materials, processes and their data selection
EN 16601-00-01:2015 Space systems - Glossary of terms
EN 16602-10-09:2014 Space product assurance - Nonconformance control system
ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards
EN 61340-5-2:2001/corrigendum:2001 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
EN 16603-10-03:2014 Space engineering - Testing
EN 16602-70-28:2014 Space product assurance - Repair and modification of printed circuit board assemblies for space use
EN 16602-70-02:2014 Space product assurance - Thermal vacuum outgassing test for the screening of space materials
EN 16602-20:2014 Space product assurance - Quality assurance
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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