BS EN 123500:1992
Current
The latest, up-to-date edition.
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections
Hardcopy , PDF
English
30-11-1990
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Foreword
Preface
1. Introduction
1.1 Scope and object
1.2 Related documents
2. General
3. Test specimens
3.1 Capability approval
3.2 Quality conformance inspection
4. Relevant specification
5. Characteristics of printed boards
Table I
Table II
6. Capability test programme
7. Quality conformance inspection
8. Test patterns
8.1 Application of test patterns
8.2 Composite test pattern (CTP)
8.3 Multiple arrangements of the CTP
Figure 2 - Composite test pattern
Figure 3 - Examples of soldered holes
Figure 4 - Examples related to access holes
Figure 5 - Examples of delamination
Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS CECC23500(1990). 1992 Version incorporates amendment 7369 to BS CECC23500(1990). Supersedes 89/23560 DC and 94/216046 DC. To be read in conjunction with BS CECC23000(1989). (08/2005)
|
| DocumentType |
Standard
|
| Pages |
34
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| CECC 23500 : 1985 | Identical |
| SN EN 123500 : AMD 2 1995 | Identical |
| I.S. EN 123500:1994 | Identical |
| EN 123500:1992/A2:1995 | Identical |
| NEN EN 123500 : 1995 AMD 2 1995 | Identical |
| DIN EN 123500:1992-11 | Identical |
| BS CECC 123500-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
| CECC 00107(PT3) : 80 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL |
| BS CECC23000(1989) : 1989 AMD 7145 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS |
| BS 6221-8:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| BS 2011(1967) : LATEST |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.