BS CECC23000(1989) : 1989 AMD 7145
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
Superseded date
01-05-1992
Superseded by
Published date
06-12-2012
Publisher
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Committee |
ECL/19
|
DevelopmentNote |
Renumbered and superseded by BS EN 123000. Supersedes 86/31647 DC. (09/2005)
|
DocumentType |
Standard
|
PublisherName |
British Standards Institution
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
CECC 23000 : 1985 | Identical |
EN 123000:1991/A2:1996 | Identical |
BS EN 123200:1992 | Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes |
BS EN 123400-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
BS EN 123500:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections |
BS EN 123100:1992 | Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes |
BS EN 123400:1992 | Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections |
BS EN 123300:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards |
BS EN 123500-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
CECC 00100 : 1988 | BASIC RULES - TO BE USED IN CONNECTION WITH THE INTERNAL REGULATIONS OF THE FEN e.V |
CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
CECC 00007 : 1978 | BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES |
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