BS 123800-003:2001
Current
The latest, up-to-date edition.
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Hardcopy , PDF
English
17-12-2001
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Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Capability qualifying component
5 Range of capability approval
6 Capability test program
7 Additional test capability
8 Traceability
Annex A (normative) Use of ANSI/IPC A-600F
Bibliography
Describes the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible multilayer printed boards with through-connections.
| Committee |
EPL/501
|
| DevelopmentNote |
To be read in conjunction with BS 123000(2001) and BS 123800(2001). Supersedes 01/204167 DC. (01/2002)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible multilayer printed boards with through-connections. It is applicable for flexible multilayer printed boards with through-connections made with the materials and surface finishes specified in clause 4.
This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.
| BS 123800:2001 | System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections |
| BS EN ISO 3543:2001 | Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method |
| BS 123000:2001 | System of quality assessment. Generic specification. Printed boards |
| BS EN 60249-2-13:1994 | Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade |
| BS 123800:2001 | System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| BS EN 60249-2-15:1994 | Specifications Flexible copper-clad polyimide film, of defined flammability |
| BS EN 123000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60249-2-15:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability |
| BS EN ISO 1463:2004 | Metallic and oxide coatings. Measurement of coating thickness. Microscopical method |
| BS 4727-1:GRP11(1991) : 1991 | GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS |
| IEC 60249-2-13:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
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