BS 123600-003:2001
Current
The latest, up-to-date edition.
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
Hardcopy , PDF
English
17-12-2001
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Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Capability qualifying component
5 Range of capability approval
6 Capability test program
7 Additional capability
8 Traceability
Annex A (normative) Use of ANSI/IPC A-600F
Bibliography
Describes capability qualifying components, its characteristics to tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability in relation to flex-rigid multiplayer printed boards with through-connections.
| Committee |
EPL/501
|
| DevelopmentNote |
To be read in conjunction with BS 123000(2001) and BS 123600(2001). Supersedes 01/204163 DC. (01/2002)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flex-rigid multilayer printed boards with through-connections. It is applicable for flex-rigid multilayer printed boards with through-connections made with the materials and surface finishes specified in clause 4.
This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.
| BS 123600:2001 | System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections |
| BS EN ISO 3543:2001 | Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method |
| BS 123600:2001 | System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections |
| IEC 60249-2-11:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards |
| BS 123000:2001 | System of quality assessment. Generic specification. Printed boards |
| BS EN 60249-2-13:1994 | Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade |
| IEC 60249-2-8:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| BS 123200:2001 | System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| BS 4584-103.1:1990 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| BS EN 60249-2-15:1994 | Specifications Flexible copper-clad polyimide film, of defined flammability |
| BS EN 60249-2-8:1995 | Specifications Specification for flexible copper-clad polyester (PETP) film |
| BS EN 123000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60249-2-15:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability |
| BS EN ISO 1463:2004 | Metallic and oxide coatings. Measurement of coating thickness. Microscopical method |
| BS 4727-1:GRP11(1991) : 1991 | GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS |
| IEC 60249-2-13:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS EN 60249-2-11:1994 | Specifications Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards |
| IEC 60249-2-12:1987 | Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards |
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