BS 123300-003:2001
Current
The latest, up-to-date edition.
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Hardcopy , PDF
English
17-12-2001
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Committees responsible
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Capability qualifying component
5 Range of capability approval
6 Capability test programme
7 Additional capability
8 Traceability
Annex A (normative) Test pattern for marking inks
Annex B (normative) Test pattern for solder masks
Annex C (normative) Test pattern for bonded heatsinks
Annex D (normative) Use of ANSI/IPC A-600F
Annex E (normative) Test method for determination of
characteristic impedence by Time Domain
Reflectometry (TDR)
Annex F (informative) Sample handling considerations
for TDR
Annex G (informative) Additional information about TDR
Bibliography
Describes the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid multilayer printed boards.
| Committee |
EPL/501
|
| DevelopmentNote |
To be read in conjunction with BS 123000(2001) and BS 123300(2001). Supersedes 01/204157 DC. (01/2002)
|
| DocumentType |
Standard
|
| Pages |
42
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to rigid multilayer printed boards. It is applicable for rigid multilayer printed boards made with the materials and surface finishes specified in clause 4.
This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.
| BS 123300:2001 | System of quality assessment. Sectional specification. Rigid multilayer printed boards |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| BS EN ISO 3543:2001 | Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| IEC 60249-2-11:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards |
| BS 123000:2001 | System of quality assessment. Generic specification. Printed boards |
| BS EN 60249-2-12:1994 | Specifications Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards |
| BS EN 61188-1-2:1998 | Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance |
| BS 2011-2.1Ca:1977 | Environmental testing. Tests Test Ca. Damp heat, steady state |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| BS 6221-2:1991 | Printed wiring boards Methods of test |
| BS 4584-103.1:1990 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| BS 123300:2001 | System of quality assessment. Sectional specification. Rigid multilayer printed boards |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| BS EN ISO 1463:2004 | Metallic and oxide coatings. Measurement of coating thickness. Microscopical method |
| BS 4727-1:GRP11(1991) : 1991 | GLOSSARY OF ELECTROTECHNICAL, POWER, TELECOMMUNICATION, ELECTRONICS, LIGHTING AND COLOUR TERMS - TERMS COMMON TO POWER, TELECOMMUNICATIONS AND ELECTRONICS - PRINTED CIRCUITS |
| BS QC 221100:1997 | Radio-frequency connectors. RF coaxial connectors with inner diameter of outer conductor 4,13 mm (0,163 in) with screw coupling. Characteristic impedance 50 ohms (Type SMA) |
| BS EN 60249-2-11:1994 | Specifications Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards |
| IEC 60249-2-12:1987 | Base materials for printed circuits - Part 2: Specifications - Specification No 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards |
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