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Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BS EN 61709 ED 3.0 - ELECTRIC COMPONENTS - RELIABILITY - REFERENCE CONDITIONS FOR FAILURE RATES AND STRESS MODELS FOR CONVERSION
Hardcopy , PDF
31-07-2017
English
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (Normative) - Failure modes of components
Annex B (Informative) - Thermal model for semiconductors
Annex C (Informative) - Failure rate prediction
Annex D (informative) - Considerations on mission profile
Annex E (informative) - Useful life models
Annex F (informative) - Physics of failure
Annex G (informative) - Considerations for the design of
a data base on failure rates
Annex H (informative) - Potential sources of failure rate
data and methods of selection
Annex I (informative) - Overview of component classification
Annex J (informative) - Presentation of component reliability
data
Annex K (informative) - Examples
Bibliography
Literature
BS EN 61709 Ed 3.0.
| Committee |
DS/1
|
| DocumentType |
Draft
|
| Pages |
109
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 62308:2006 | Equipment reliability - Reliability assessment methods |
| IEC 61812-1:2011 | Time relays for industrial and residential use - Part 1: Requirements and tests |
| IEC 61649:2008 | Weibull analysis |
| IEC 61014:2003 | Programmes for reliability growth |
| IEC 60050-151:2001 | International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices |
| IEC 61360-4:2005 | Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes |
| VITA 51.2 : 2016 | PHYSICS OF FAILURE RELIABILITY PREDICTIONS |
| ISO 10303-31:1994 | Industrial automation systems and integration Product data representation and exchange Part 31: Conformance testing methodology and framework: General concepts |
| ISO 10303-11:2004 | Industrial automation systems and integration Product data representation and exchange Part 11: Description methods: The EXPRESS language reference manual |
| IEC 61810-2:2017 | Electromechanical elementary relays - Part 2: Reliability |
| IEC 61163-2:1998 | Reliability stress screening - Part 2: Electronic components |
| DEFSTAN 00-42(PT3)/4(2011) : 2011 | RELIABILITY AND MAINTAINABILITY ASSURANCE GUIDE - PART 3: R&M CASE |
| IEC 60300-3-2:2004 | Dependability management - Part 3-2: Application guide - Collection of dependability data from the field |
| IEC 61810-2-1:2017 | Electromechanical elementary relays - Part 2-1: Reliability - Procedure for the verification of B<sub>10</sub> values |
| IEC 61703:2016 | Mathematical expressions for reliability, availability, maintainability and maintenance support terms |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| MIL-C-18312 Revision G:2013 | CAPACITOR, FIXED, METALLIZED (PAPER-PLASTIC, OR PLASTIC FILM) DIELECTRIC, DIRECT CURRENT (HERMETICALLY SEALED IN METAL CASES), GENERAL SPECIFICATION FOR |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
| IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
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