IEC 62739-1:2013
Current
The latest, up-to-date edition.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
English - French
18-06-2013
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test
5 Method of erosion depth measurement
(focal depth method with optical microscope)
6 Items to be recorded in test report
Annex A (normative) - Specifications of test
equipment & measurement equipment
Annex B (informative) - Method of estimation of
maximum erosion depth by extreme
value statistical analysis
Bibliography
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
| Committee |
TC 91
|
| DevelopmentNote |
Stability date: 2018. (06/2013)
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 62739-1 : 2014 | Identical |
| NEN EN IEC 62739-1 : 2013 | Identical |
| PN EN 62739-1 : 2013 | Identical |
| BS EN 62739-1:2013 | Identical |
| CEI EN 62739-1 : 2014 | Identical |
| EN 62739-1:2013 | Identical |
| DIN EN 62739-1:2014-02 | Identical |
| JIS C 62739-1:2015 | Identical |
| UNE-EN 62739-1:2013 | Identical |
| EN 62739-2:2016 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing |
| BS EN 62739-2:2016 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing |
| BS EN 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods |
| I.S. EN 62739-2:2016 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING |
| IEC 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
| CEI EN 62739-3 : 1ED 2017 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
| IEC 62739-2:2016 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing |
| I.S. EN 62739-3:2017 | TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS |
| 16/30338642 DC : 0 | BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD |
| EN 62739-3:2017 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 16143-3:2014 | Stainless steels for general purposes — Part 3: Wire |
| ISO 16143-2:2014 | Stainless steels for general purposes — Part 2: Corrosion-resistant semi-finished products, bars, rods and sections |
| ISO 16143-1:2014 | Stainless steels for general purposes — Part 1: Corrosion-resistant flat products |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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