IEC 61182-2:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
English
27-09-2006
31-12-2021
FOREWORD
1 Scope and object
1.1 Focus and intent
1.2 Notation
2 Normative references
3 Documentation conventions
4 Requirements
4.1 Rules concerning the use of XML and XML Schema
4.2 Data organization and identification rules
4.3 Transformation characteristics (Xform)
4.4 Substitution groups
5 Content
5.1 Content: FunctionMode
5.2 Function levels
5.3 Content: StepListRef
5.4 Content: LayerDescRef
5.5 Content: BomRef
5.6 Content: AvlRef
5.7 Content: DictionaryStandard
5.8 Content: DictionaryUser
5.9 Content: DictionaryFont
5.10 Content: DictionaryLineDesc
5.11 Content: DictionaryColor
5.12 Content: DictionaryFirmware
6 Logistic header
6.1 LogisticHeader
6.2 Role
6.3 Enterprise
6.4 Person
7 History record
7.1 HistoryRecord
7.2 FileRevision
7.3 SoftwarePackage
7.4 ChangeRec
8 BOM (Material List)
8.1 BOM Header
8.2 BomItem
9 Electronic computer aided design (ecad)
9.1 CadHeader
9.2 CadData/LayerDesc
9.3 CadData/StepList
10 Approved vendor list (AVL)
10.1 AvlHeader
10.2 AvlItem
11 Glossary.
Annexe A (informative) IPC-7351 Naming Convention for Land
Patterns
Annexe B - Informative references
Specifies the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.
| DocumentType |
Standard
|
| Pages |
161
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NEN IEC 61182-2 : 2006 | Identical |
| BS IEC 61182-2:2006 | Identical |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| 16/30333621 DC : 0 | BS EN 61188-7 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| 07/30169578 DC : 0 | BS EN 61188-7 - PRINTED BOARD AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: SECTIONAL REQUIREMENTS - ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 61188-5-8:2007 | Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| ISO 10303-212:2001 | Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| ISO 10303-210:2011 | Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect, and packaging design |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
Access your standards online with a subscription
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.
Important note : All end users must be registered with an Account prior to user licenses being assigned.