UNI EN ISO 9453 : 2014
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS
18-02-2021
01-01-2014
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
in ISO 9453 and short names and chemical
compositions according to IEC 61190-1-3
Annex B (informative) - Patented alloys and patent holder list
Bibliography
Defines the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
Committee |
U28.00
|
DevelopmentNote |
Supersedes UNI EN 29453. (09/2007)
|
DocumentType |
Standard
|
PublisherName |
Ente Nazionale Italiano di Unificazione (UNI)
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Standards | Relationship |
ONORM EN ISO 9453 : 2014 | Identical |
NS EN ISO 9453 : 2014 | Identical |
SN EN ISO 9453 : 2014 | Identical |
BS EN ISO 9453:2014 | Identical |
I.S. EN ISO 9453:2014 | Identical |
NEN EN ISO 9453 : 2014 | Identical |
ISO 9453:2014 | Identical |
DIN EN ISO 9453:2014-12 | Identical |
EN ISO 9453:2014 | Identical |
NBN EN ISO 9453 : 2014 | Identical |
UNE-EN ISO 9453:2015 | Identical |
NF EN ISO 9453 : 2014 | Identical |
UNI 11528 : 2014 | GAS PLANTS OVER 35 KW - DESIGN, INSTALLATION AND COMMISSIONING |
ISO 3677:2016 | Filler metal for soldering and brazing — Designation |
IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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