SAE AS 6294/1 : 2017
Current
The latest, up-to-date edition.
REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS
Hardcopy , PDF
English
21-11-2017
RATIONALE
ACKNOWLEDGMENT
1. SCOPE
2. REFERENCES
3. GENERAL REQUIREMENTS
4. Device Classification Determination
5. DEVICE CHARACTERIZATION
6. REQUIREMENTS FOR SCREENING
7. BURN-IN AND ELECTRICAL MEASUREMENT
REQUIREMENTS
8. REQUIREMENTS FOR LOT ACCEPTANCE
TESTING
9. NOTES
APPENDIX A - PEM Capability Requirements Determination
This document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments.
Committee |
CE-12
|
DocumentType |
Standard
|
Pages |
22
|
PublisherName |
SAE International
|
Status |
Current
|
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NASA STD 6001 : 2011 | FLAMMABILITY, OFFGASSING, AND COMPATIBILITY REQUIREMENTS AND TEST PROCEDURES |
ASTM E 595 : 2015 : REDLINE | Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment |
IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
MIL-PRF-38535 Revision K:2013 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
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