PREN ISO 9453 : DRAFT 2013
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO/DIS 9453:2013)
01-08-2014
25-04-2013
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
in ISO 9453 and short names and chemical
compositions according to IEC 61190-1-3
Bibliography
Describes the requirements for chemical composition for soft solder alloys containing two or more of: - tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| Committee |
TC 121
|
| DocumentType |
Draft
|
| PublisherName |
Comite Europeen de Normalisation
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| 13/30260487 DC : 0 | Identical |
| ISO 3677:2016 | Filler metal for soldering and brazing — Designation |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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