PD IEC/TS 62668-2:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources
Hardcopy , PDF
07-10-2019
English
31-08-2016
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Technical requirements
Annex A (informative) - Flowchart of IEC TS 62668-1
requirements
Annex B (informative) - Example of detailed tests
list, linked with procurement risks levels
Annex C (informative) - iNEMI assessment methodology
and metric development
Annex D (informative) - Summary of SAE AS6171
proposed test methods under consideration by
SAE International
Bibliography
Describes requirements for avoiding the use of counterfeit, recycled and fraudulent components when these components are not purchased from the original component manufacturer (OCM) or are purchased from outside of franchised distributor networks for use in the aerospace, defence and high performance (ADHP) industries.
| Committee |
GEL/107
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
This part of IEC 62668, which is a technical specification, defines requirements for avoiding the use of counterfeit, recycled and fraudulent components when these components are not purchased from the original component manufacturer (OCM) or are purchased from outside of franchised distributor networks for use in the aerospace, defence and high performance (ADHP) industries. This practice is used, as derogation, only when there are no reasonable or practical alternatives.
NOTE Typically this technical specification is used in conjunction with IEC TS 62239-1 and IEC TS 62668-1,
enabling ADHP industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains.
Although developed for the ADHP industry, this document may be used by other high-performance and high-reliability industries, at their discretion.
| Standards | Relationship |
| IEC TS 62668-2:2016 | Identical |
| EN 9100:2009 | Quality Management Systems - Requirements for Aviation, Space and Defense Organizations |
| SAE AS 5553B : 2016 | COUNTERFEIT ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS; AVOIDANCE, DETECTION, MITIGATION, AND DISPOSITION |
| ISO 16678:2014 | Guidelines for interoperable object identification and related authentication systems to deter counterfeiting and illicit trade |
| SAE AS 6174 : 2014 | COUNTERFEIT MATERIEL - ASSURING ACQUISITION OF AUTHENTIC AND CONFORMING MATERIEL |
| SAE AS 6171/1 : 2016 | SUSPECT/COUNTERFEIT TEST EVALUATION METHOD |
| SAE AS 6171 : 2016 | TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| SAE AS 6171/6 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS |
| IEC PAS 62435:2005 | Electronic components - Long-duration storage of electronic components - Guidance for implementation |
| MIL-PRF-55681 Revision G:2016 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| SAE AS 6171/11 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS |
| SAE AS 6171/7 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ELECTRICAL TEST METHODS |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| ISO 31000:2009 | Risk management Principles and guidelines |
| IEC TS 62668-1:2016 | Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components |
| SEMI T20.2 : 2009(R2016) | GUIDE FOR QUALIFICATIONS OF AUTHENTICATION SERVICE BODIES FOR DETECTING AND PREVENTING COUNTERFEITING OF SEMICONDUCTORS AND RELATED PRODUCTS |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-106 Base Document:2015 | Method 106, Moisture Resistance |
| MIL-PRF-39014 Revision J:2016 | Capacitor, Fixed, Ceramic Dielectric (General Purpose), Established Reliability and Non-Established Reliability, General Specification for |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| SAE AS 6171/8 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS |
| SAE AS 6171/3 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY X-RAY FLUORESCENCE TEST METHODS |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| SAE AS 6171/4 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DELID/DECAPSULATION PHYSICAL ANALYSIS TEST METHODS |
| SEMI T20.1 : 2009(R2016) | SPECIFICATION FOR OBJECT LABELING TO AUTHENTICATE SEMICONDUCTORS AND RELATED PRODUCTS IN AN OPEN MARKET |
| GEIA STD 0016 : 2012 | PREPARING A DMSMS MANAGEMENT PLAN |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| SAE ARP 6178 : 2011 | FRAUDULENT/COUNTERFEIT ELECTRONIC PARTS - TOOL FOR RISK ASSESSMENT OF DISTRIBUTORS |
| SAE AS 6171/9 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY FOURIER TRANSFORM INFRARED SPECTROSCOPY (FTIR) TEST METHODS |
| MIL-PRF-39003 Revision N:2016 | Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for |
| ISO 9001:2015 | Quality management systems — Requirements |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| SAE AS 6171/5 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RADIOLOGICAL TEST METHODS |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
| SEMI T20 : 2010(R2016) | SPECIFICATION FOR AUTHENTICATION OF SEMICONDUCTORS AND RELATED PRODUCTS |
| EN 9120:2010 | Quality Management Systems - Requirements for Aviation, Space and Defence Distributors |
| SAE AS 6171/10 : 2016 | TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS |
| ISO Guide 73:2009 | Risk management — Vocabulary |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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