NF EN 62326 4-1 : 1998
Current
The latest, up-to-date edition.
PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C
12-01-2013
AVANT-PROPOS
1 Domaine d'application
2 Références normatives
3 Composant pour l'agrément de savoir-faire (CQC)
4 Agrément de savoir-faire
5 Démonstration du savoir-faire
6 Carte de démonstration du savoir-faire (CTB)
Figures
Annexes
A Acronymes relatifs à l'IECQ et leur explication
B Tableau de conversion
C Bibliographie
ANNEXE ZA Autres publications internationales citées dans la
présente norme avec les références des publications
européennes correspondantes
La présente spécification particulière d'agrément (Cap DS) est basée sur la CEI 2326-4. Elle concerne les cartes imprimées multicouches rigides avec connexions transversales.
| DevelopmentNote |
Indice de classement: C93-708-1. (11/2003)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Standards | Relationship |
| EN 62326-4-1:1997 | Identical |
| IEC 62326-4-1:1996 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| NFC 20 723 : LATEST | |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| HD 323.2.3 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| NFC 20 720 : 87 AMD 1 1988 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING |
| HD 323.2.38 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TESTS Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST |
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