Customer Support: 131 242

  • Shopping Cart
    There are no items in your cart
We noticed you’re not on the correct regional site. Switch to our AMERICAS site for the best experience.
Dismiss alert

NEN EN IEC 62137 : 2004 C11 2005

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN

Superseded date

13-03-2015

Published date

12-01-2013

Sorry this product is not available in your region.

Describes the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of re-flow solder mounted area array type packages and peripheral terminal type packages.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Superseded
SupersededBy

Standards Relationship
EN 62137:2004/corrigendum:2005 Identical
IEC 62137:2004 Identical

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.