NASA JSC 66491 : 2013
Current
The latest, up-to-date edition.
STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
Hardcopy , PDF
English
01-07-2013
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1 GENERAL REQUIREMENTS
2 APPLICABLE DOCUMENTS
3 LEAD-FREE CONTROL PLAN (LFCP)
4 ACRONYMS AND ABBREVIATIONS AND GLOSSARY OF TERMS
Describes requirements for the control and mitigation of performance and reliability risks associated with the use of Lead-free Tin (Sn) and Lead-free Tin (Sn) technology in flight hardware, mission essential support equipment, and elements thereof.
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
National Aeronautics and Space Administration
|
| Status |
Current
|
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| MIL-D-3464 Revision E:1987 | DESICCANTS, ACTIVATED, BAGGED, PACKAGING USE AND STATIC DEHUMIDIFICATION |
| NASA STD 8739.1 : 2016 | WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES |
| NASA STD 8739.3 : 1998 | SOLDERED ELECTRICAL CONNECTIONS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| NASA STD 8739.2 : 1999 | WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY |
| MIL-STD-2073-1 Revision E:2008 | STANDARD PRACTICE FOR MILITARY PACKAGING |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| MIL-HDBK-338 Revision B:1998 | ELECTRONIC RELIABILITY DESIGN HANDBOOK |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-1 : 2006 | PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS |
| IPC 1601 : 0 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| GEIA STD 0003 : 2006 | LONG TERM STORAGE OF ELECTRONIC DEVICES |
| NASA STD 8709.20 : 2010 | MANAGEMENT OF SAFETY AND MISSION ASSURANCE TECHNICAL AUTHORITY (SMA TA) REQUIREMENTS |
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