NAS4123:2024
Current
Current
The latest, up-to-date edition.
HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)
Available format(s)
Hardcopy
Language(s)
English
Published date
31-01-2024
Publisher
| DocumentType |
Revision
|
| Pages |
16
|
| PublisherName |
Aerospace Industries Association
|
| Status |
Current
|
| Supersedes |
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