MIL-STD-275 Revision E:1984
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PRINTED WIRING - ELECTRONIC EQUIPMENT
30-09-1999
1. SCOPE
1.1 Purpose
1.2 Classification
2. REFERENCED DOCUMENTS
3. DEFINITIONS
4. GENERAL REQUIREMENTS
4.1 Design features
4.2 Documentation
4.3 Master drawing
4.4 Printed-wiring assembly drawing
4.5 Production master
5. DETAIL BOARD REQUIREMENTS
5.1 Conductive pattern
5.2 Lands
5.3 Holes
5.4 Eyelets and standoff terminals
5.5 Plated-through holes
5.6 Materials
5.7 Printed-wiring board dimensions
5.8 Detail board marking requirements
5.9 Quality conformance testing circuitry
6. DETAIL PART MOUNTING REQUIREMENTS
6.1 Approved methods of attachment
6.2 Electrical part mounting
6.3 Conformal coating
6.4 Support
6.5 Detailed assembly marking requirements
APPENDIX
10. SCOPE
10.1 Purpose
20. DESIGN CONSIDERATIONS
20.1 Design process tolerances and allowances
20.2 Board dimensions
20.3 Dimensional stability
20.4 Dielectric constant and dissipation factor
20.5 Surface prepartion of large conductive areas
20.6 High voltage factors
TABLES
I. Conductor spacing
II. Standard fabrication allowances for plated-through
hole attachment
III. Standard fabrication allowances for surface
attachments
IV. Clad laminates
V. Conformance test circuitry
VI. Composite board design guidance
FIGURES
1. Quality conformance test circuitry
2. Block diagram depicting typical printed wiring
drawing relationships
3. Use of grids in defining pattern requirements
4. Conductor thickness and width
5. Discrete leadless component land pattern
6. Chip carrier land pattern
7. Modified fan-out patterns
8. Heel mounting requirements
9. Typical flat pack land
10. Coined or flattened lead lands
11. Annular ring requirements (external)
12. Annular ring requirements (internal
13. Minimum annular ring dimensions (external)
14. Ground plan lands (typical)
15. Hole diameter for flat lead
16. Dielectric layer thickness measurement
17. Location of test coupon based on number of boards
fabricated per panel
18. Flat lead termination
19. Lead bend
20. Perpendicular part mounting
Covers design requirements for various printed-wiring boards. The coverage includes referenced documents, definitions, documentation, master drawing, production master, conductive pattern, materials, electrical part mounting, quality conformance testing circuitry, detailed assembly marking requirements, board dimensions, plated through holes, dimensional stability, conductor spacing, composite board design guidance, eyelets & stand-off terminals.
Committee |
FSC 5998
|
DocumentType |
Standard
|
Pages |
72
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
MIL-STD-2110 Base Document:1979 | RESTORATION, OVERHAUL, AND REPAIR OF ELECTRONIC EQUIPMENT |
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MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
MIL-A-29505 Base Document:1966 | Antenna Group, Tacan, OE-273(V)/Urn |
DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
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MIL-S-24158 Base Document:1965 | STATIC ADJUSTABLE SPEED CONTROL SYSTEM FOR A.C. INDUCTION MOTOR (ADJUSTABLE FREQUENCY TYPE) NAVAL SHIPBOARD |
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MIL-P-28739 Base Document:1970 | Pedestal Group, Antenna, for IFF Antennas AN/UPA-57 |
MIL-B-63299 Revision A:1983 | BODY ASSEMBLY FOR MINE, ANTI-PERSONNEL: HE, M74 |
GR 2969 CORE : ISSUE 1 | GENERIC REQUIREMENTS FOR THE DESIGN AND MANUFACTURE OF SHORT-LIFE, INFORMATION-HANDLING PRODUCTS AND EQUIPMENT |
MIL-A-21577-8 Revision A:1967 | AMPLIFIER-CONTROL GROUP, AN/SIA-12O |
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