MIL R 28750 : C SUPP 1
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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RELAYS, SOLID STATE, SEALED, OPTICALLY ISOLATED, ZERO VOLTAGE TURN ON, 25 AMPERES, 250 VOLTS MAXIMUM, 45-440 HZ, POWER SWITCHING
Superseded date
01-02-1999
Superseded by
Published date
12-01-2013
Publisher
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Specifies hermetically sealed or encapsulated solid state relays using only semiconductor and passive circuit devices.
| Committee |
FSC 5945
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| DocumentType |
Standard
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| PublisherName |
US Military Specs/Standards/Handbooks
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| Status |
Superseded
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| SupersededBy |
| MIL S 16036 : K | SWITCHGEAR, POWER, NAVAL SHIPBOARD |
| MIL-HDBK-217 Revision F:1991 | RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT |
| MIL E 17807 : C | ELEVATOR, WEAPON AND CARGO, ELECTROMECHANICAL (SHIPBOARD) |
| MIL E 917 : E | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS (NAVAL SHIPBOARD USE) |
| MIL-STD-1346 Revision C:1994 | RELAY, SELECTION AND APPLICATION |
| MIL-P-11268 Revision L:1983 | PART, MATERIALS, AND PROCESSES USED IN ELECTRONIC EQUIPMENT |
| PPP-C-1752 Revision D:1989 | CUSHIONING MATERIAL, PACKAGING, POLYETHYLENE FOAM |
| MIL-STD-1772 Revision B:1990 | CERTIFICATION REQUIREMENTS FOR HYBRID MICROCIRCUITS FACILITIES AND LINES |
| ASME Y32.2 : LATEST | DRAW AND TERM - GRAPHICS SYMBOLS STANDARDS - FOR ELECTRICAL AND ELECTRONIC DIAGRAMS |
| MIL-I-23011 Revision C:1974 | IRON-NICKEL ALLOYS FOR SEALING TO GLASS AND CERAMICS |
| MIL-B-117G:1993 | BAG, SLEEVE AND TUBING |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| ASTM D 3953 : 2015 : REDLINE | Standard Specification for Strapping, Flat Steel and Seals |
| PPP-B-636 Revision J:1981 | BOX, SHIPPING, FIBERBOARD |
| MIL B 81705 : C | BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE |
| MIL-STD-2073-1 Revision E:2008 | STANDARD PRACTICE FOR MILITARY PACKAGING |
| MIL C 17 : G | CABLES, RADIO FREQUENCY, FLEXIBLE AND SEMIRIGID, GENERAL SPECIFICATION FOR |
| MIL-P-15047 Revision C:1971 | PLASTIC MATERIAL, LAMINATED THERMOSETTING SHEETS, NYLON FABRIC BASE, PHENOLIC RESIN |
| MIL-P-997 Revision D:1966 | PLASTIC MATERIAL, LAMINATED, THERMOSETTING, ELECTRIC INSULATION, SHEETS, GLASS CLOTH, SILICONE RESIN |
| MIL-STD-1686 Revision C:1995 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES) |
| ASTM F 30 : 1996 | Standard Specification for Iron-Nickel Sealing Alloys |
| MIL-STD-45662 Revision A:1988 | CALIBRATION SYSTEMS REQUIREMENTS |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| MIL-STD-889 Revision C:2016 | DISSIMILAR METALS |
| FED-STD-209 Revision E:1992 | AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
| PPP-C-1797 Revision A:1982 | CUSHIONING MATERIAL, RESILIENT, LOW DENSITY, UNICELLULAR POLYPROPYLENE FOAM |
| MIL-R-27777 Revision B:1973 | RELAY, TELEGRAPH, PASSIVE, SOLID STATE, GENERAL SPECIFICATION FOR |
| MIL-I-10 Revision B:1966 | INSULATING COMPOUND ELECTRICAL CERAMIC CLASS 1 |
| PPP-C-795 Revision D:1994 | Cushioning Material, Closed Cell Flexible, Plastic Film |
| FED-STD-123 Revision H:2007 | MARKING FOR SHIPMENT (CIVIL AGENCIES) |
| MIL-STD-1520 Revision C:1986 | CORRECTIVE ACTION AND DISPOSITION SYSTEM FOR NONCONFORMING MATERIAL |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| MIL-STD-790 Revision G:2011 | ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
| MIL-N-46026 Revision A:1965 | NICKEL ROD AND WIRE (ROUND) (FOR ELECTRONIC USE) |
| MIL-STD-461 Revision G:2015 | REQUIREMENTS FOR THE CONTROL OF ELECTROMAGNETIC INTERFERENCE CHARACTERISTICS OF SUBSYSTEMS AND EQUIPMENT |
| MIL-STD-977 Base Document:1982 | TEST METHODS AND PROCEDURES FOR MICROCIRCUIT LINE CERTIFICATION |
| MIL-P-15037 Revision E:1965 | PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS CLOTH, MELAMINE RESIN |
| MIL S 19500 : J | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| MIL-P-116 Revision J:1988 | PRESERVATION, METHODS OF |
| MIL H 38534 : B (1) | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| MIL C 55681 : D SUPP 1 | CAPACITOR, CHIP, MULTIPLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| PPP-B-601 Revision H:1989 | BOXES, WOOD, CLEATED PLYWOOD |
| MIL-STD-1346 Revision C:1994 | RELAY, SELECTION AND APPLICATION |
| MIL R 55342 : C | RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL-STD-462 Revision D:1993 | MEASUREMENT OF ELECTROMAGNETIC INTERFERENCE CHARACTERISTICS |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
| MIL-STD-1285 Revision D:2004 | MARKING OF ELECTRICAL AND ELECTRONIC PARTS |
| FED-STD-H28 Revision A:1994 | Screw-Thread Standards for Federal Services |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
| PPP-B-621 Revision D:1981 | BOXES, WOOD, NAILED AND LOCK CORNER |
| ZZ-R-765 Revision E:1991 | RUBBER, SILICONE; RUBBER SHEET SOLID |
| PPP-C-1842 Revision B:1992 | CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS) |
| MIL-STD-1189 Revision B:1989 | BAR CODE SYMBOLOGY, STANDARD DEPARTMENT OF DEFENSE |
| MIL-M-14 Revision H:1990 | MOLDING COMPOUNDS, THERMOSETTING |
| MIL R 28776 : C | RELAY, HYBRID, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
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