MIL-PRF-32535 Revision A:2017
Current
The latest, up-to-date edition.
Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, General Specification for
31-10-2017
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
APPENDIX A - PROCEDURE FOR QUALIFICATION
INSPECTION
APPENDIX B - VISUAL INSPECTION CRITERIA
FOR CHIP CAPACITORS
APPENDIX C - ULTRASONIC INSPECTION OF
CERAMIC CAPACITORS
Specifies the general requirements for extended range, general purpose and temperature stable, surface mount, ceramic capacitors.
| DocumentType |
Standard
|
| Pages |
49
|
| ProductNote |
NEW CHILD SUPP 1A 2018 NOW ADDED
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This specification covers the general requirements for extended range, general purpose and temperature stable, surface mount, ceramic capacitors. Two product levels are offered: M level (standard reliability) and T level (high reliability). T level capacitors are intended for use in space, missile, and other high reliability applications (see 6.11). MIL-PRF-32535 capacitors have higher capacitance values than MIL-PRF-123 and MIL-PRF-55681 capacitors of the same size and voltage rating.
| MIL-STD-202-302 Base Document:2015 | Method 302, Insulation Resistance |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-202-210 Base Document:2015 | Method 210, Resistance to Soldering Heat |
| MIL-STD-202-305 Base Document:2015 | Method 305, Capacitance |
| MIL-STD-202-107 Base Document:2015 | Method 107, Thermal Shock |
| MIL-STD-202-301 Base Document:2015 | Method 301, Dielectric Withstanding Voltage |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| MIL-STD-790 Revision G:2011 | ESTABLISHED RELIABILITY AND HIGH RELIABILITY QUALIFIED PRODUCTS LIST (QPL) SYSTEMS FOR ELECTRICAL, ELECTRONIC, AND FIBER OPTIC PARTS SPECIFICATIONS |
| MIL-STD-202-108 Base Document:2015 | Method 108, Life (at Elevated Ambient Temperature) |
| MIL-STD-202-208 Base Document:2015 | Method 208, Solderability |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
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