MIL-P-70661 Base Document:1987
Current
Current
The latest, up-to-date edition.
POTTED CIRCUIT CARD ASSEMBLY FOR TOW-2E/6 PROBE AND S&A ASSEMBLY
Available format(s)
PDF
Publisher
Covers requirements, quality assurance provisions, testing and packaging of electronic assembly.
Committee |
FSC 1336
|
DevelopmentNote |
NOTICE 1 - Notice of Inactivation for New Design. (05/2014)
|
DocumentType |
Standard
|
Pages |
36
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Current
|
MIL-P-48698 Base Document:1987 | PROBE AND S&A ASSEMBLY, TOW-2/E6 |
MIL-STD-275 Revision E:1984 | PRINTED WIRING - ELECTRONIC EQUIPMENT |
MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
MIL-A-48078 Revision A:1988 | AMMUNITION, STANDARD QUALITY ASSURANCE PROVISIONS, GENERAL SPECIFICATION FOR |
MIL R 14293 : A | RESISTOR, FIXED, HIGH MEGOHM (HERMETICALLY SEALED) |
MIL-STD-105 Revision E:1989 | SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES |
MIL-P-48698 Base Document:1987 | PROBE AND S&A ASSEMBLY, TOW-2/E6 |
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