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MIL-M-55565 Revision C:1988

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

MICROCIRCUITS, PACKAGING OF

Available format(s)

PDF

Superseded date

15-08-2001

$32.74
Including GST where applicable

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. QUALITY ASSURANCE PROVISIONS
5. PACKAGING
6. NOTES

Outlines requirements for preservation, packing, and container marking of microcircuits.

Committee
FSC PACK
DevelopmentNote
C NOTICE 1 - Notice of Cancellation/Superseded by MIL STD 2073/1 (03/2004)
DocumentType
Standard
Pages
14
PublisherName
US Military Specs/Standards/Handbooks
Status
Superseded
SupersededBy

MIL-M-63530 Base Document:1982 MICROCIRCUIT, DIGITAL, CMOS (LOGIC)
MIL-E-17555 Revision H:1984 ELECTRONIC AND ELECTRICAL EQUIPMENT, ACCESSORIES, AND PROVISIONED ITEMS (REPAIR PARTS); PACKAGING OF
MIL-P-9024 Revision G:1972 PACKAGING, MATERIALS HANDLING AND TRANSPORTABILITY, SYSTEM AND SYSTEM SEGMENTS GENERAL SPECIFICATION FOR
MIL I 38535 : B (1) INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
MIL-M-38510 Revision J:1991 MICROCIRCUITS, SPECIFICATION FOR
MIL-STD-726 Revision H:1985 PACKAGING REQUIREMENTS CODE
MIL-I-48632 Base Document:1986 INTEGRATED CIRCUIT, DIGITAL CMOS CONTROL AND TIMING BASE, MONOLITHIC, SILICON
MIL-S-49433 Base Document:1984 SURFACE ACOUSTIC WAVE DEVICES, GENERAL SPECIFICATION FOR
MIL-M-63323 Revision A:1981 MICROCIRCUIT, LINEAR, VOLTAGE COMPARATORS
MIL M 64020D : 1989 MICROCIRCUIT, AMPLIFIER, BIPOLAR, HIGH FREQUENCY, FRONT END
MIL D 83532 : A (3) SUPP 1 DELAY LINES, ACTIVE
MIL-M-48646 Base Document:1986 MICROCIRCUIT, DIGITAL, SCO/DLA MULTICHIP CMOS
MIL-M-63324 Revision A:1981 MICROCIRCUIT, DIGITAL, CMDS, SPECIAL PURPOSE NOR GATE
MIL-I-48634 Base Document:1986 INTEGRATED CIRCUIT, DIGITAL, CMOS LOGIC ARRAY MONOLITHIC, SILICON
MIL C 83446 : B COIL, RADIO FREQUENCY, CHIP, FIXED OR VARIABLE, GENERAL SPECIFICATION FOR
MIL-M-63321 Revision A:1981 MICROCIRCUIT, DIGITAL, CMOS (FINAL LOGIC)
MIL-F-48370 Revision A:1985 FUZE M934E6, HYBRID MICROCIRCUITS FOR
MIL-I-48331 Revision A:1979 INTEGRATED CIRCUIT, DIGITAL, CMOS, TIME BASE AND SPECIAL PURPOSE FUNCTION GENERATOR, MONOLITHIC, SILICON
MIL-A-63242 Revision A:1982 AMPLIFIER, OPERATIONAL TRIPLE PROGRAMMABLE MICROPOWER
MIL-M-48647 Base Document:1986 MICROCIRCUIT, DIGITAL, DECODER, LOGIC ARRAY
MIL-M-63320 Revision A:1981 MICROCIRCUIT, DIGITAL, CMOS (INITIAL LOGIC)
MIL-STD-1331 Base Document:1969 PARAMETER TO BE CONTROLLED FOR THE SPECIFICATION OF MICROCIRCUITS

PPP-C-1752 Revision D:1989 CUSHIONING MATERIAL, PACKAGING, POLYETHYLENE FOAM
MIL-B-117G:1993 BAG, SLEEVE AND TUBING
MIL-STD-129 Revision R:2014 Military Marking for Shipment and Storage
MIL D 83532 : A (3) SUPP 1 DELAY LINES, ACTIVE
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
PPP-B-636 Revision J:1981 BOX, SHIPPING, FIBERBOARD
MIL B 81705 : C BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC FREE HEAT SEALABLE
MIL-STD-2073-1 Revision E:2008 STANDARD PRACTICE FOR MILITARY PACKAGING
PPP-B-566 Revision E:1974 BOX, FOLDING, PAPERBOARD
MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
QQ-S-781 Revision H:1974 STRAPPING, STEEL, AND SEALS
MIL-M-38510 Revision J:1991 MICROCIRCUITS, SPECIFICATION FOR
PPP-C-1797 Revision A:1982 CUSHIONING MATERIAL, RESILIENT, LOW DENSITY, UNICELLULAR POLYPROPYLENE FOAM
PPP-C-795 Revision D:1994 Cushioning Material, Closed Cell Flexible, Plastic Film
FED-STD-123 Revision H:2007 MARKING FOR SHIPMENT (CIVIL AGENCIES)
PPP-B-676 Revision E:1992 BOXES SET-UP
MIL-STD-794 Revision E:1982 PART AND EQUIPMENT, PROCEDURES FOR PACKAGING AND PACKING OF
MIL-P-116 Revision J:1988 PRESERVATION, METHODS OF
PPP-B-601 Revision H:1989 BOXES, WOOD, CLEATED PLYWOOD
PPP-B-621 Revision D:1981 BOXES, WOOD, NAILED AND LOCK CORNER
PPP-C-1842 Revision B:1992 CUSHIONING MATERIAL, PLASTIC, OPEN CELL (FOR PACKAGING APPLICATIONS)
MIL-STD-105 Revision E:1989 SAMPLING PROCEDURES AND TABLES FOR INSPECTION BY ATTRIBUTES

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