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MIL-C-47224 Revision B:1993

Current

Current

The latest, up-to-date edition.

COMPOUND, MOLDING, TRANSFER, EPOXY RESIN, SINGLE COMPONENT

Available format(s)

PDF

Specifies one type of single-component, epoxy resin transfer molding compound for potting, encapsulating, and embedding electrical devices requiring good thermal conductivity.

Committee
FSC 9330
DevelopmentNote
B NOTICE 1 - Notice of Inactivation for New Design. B NOTICE 2 - Notice of Validation but remains Inactive for New Design. (05/2018)
DocumentType
Standard
Pages
15
ProductNote
NEW CHILD NOT 2 2018 IS NOW ADDED
PublisherName
US Military Specs/Standards/Handbooks
Status
Current

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