JIS C 6482:1997
Current
The latest, up-to-date edition.
Copper-clad laminates for printed wiring boards - Paper base, epoxy resin
Hardcopy , PDF
Japanese, English
28-02-1997
This Japanese Industrial Standard specifies the copper-clad laminates for printed wiring boards using paper base, epoxy resin (hereafter referred to as "copper-clad laminates").
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Reaffirmed 2015 97(R2015) [20/10/2015]97(R2010) [01/10/2010]97(R2001) [20/09/2001]97 [01/06/1997]91 [01/09/1991]86
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS Z 3851:1992 | Standard qualification procedure for micro soldering technique |
| JIS C 5013:1996 | Single and double sided printed wiring boards |
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